Technical Program Committee
Chairmen:
P.C. Ching, Chinese University of Hong Kong
W. Jenkins, Penn State University
Michael S. Brandstein, Harvard University, Audio and Electroacoustics
Magdy Bayoumi, University of Louisiana, Lafayette, Design & Implementation of Signal Processing Systems
Thrasyvoulos N. Pappas, Northwestern University, Image and Multidimensional Signal Processing
Jennifer Q. Trelewicz, IBM Almaden Research Center, Industry Technology Tracks
John A. Sorensen, IT University of Copenhagen, Multimedia Signal Processing
Scott C. Douglas, Southern Methodist University, Neural Networks for Signal Processing
Tulay Adali, University of Maryland, Baltimore County, Neural Networks for Signal Processing
Arye Nehorai, University of Illinois at Chicago, Sensor Array and Multichannel Signal Processing
Kon Max Wong, McMaster University, Sensor Array and Multichannel Signal Processing
Alex B. Gershman, McMaster University, Sensor Array and Multichannel Signal Processing
Thad B. Welch, U.S. Naval Academy, Signal Processing Education
Alle-Jan van der Veen, Delft University of Technology, Signal Processing for Communications
Mats Viberg, Chalmers University of Technology, Signal Processing Theory and Methods
Michael Picheny, IBM T.J. Watson Research Center, Speech Processing
Members:
Esam Abdel-Raheem, Ain Shams University, Egypt
Douglas Abraham, Office of Naval Research, United States
Alex Acero, Microsoft Research, United States
Nicola Acito, University of Pisa, Italy
Tulay Adali, University of Maryland, Baltimore County, United States
Ashish Aggarwal, University of California, Santa Barbara, United States
Ruth Aguilarponce, Assistant Research, United States
Kiyoharu Aizawa, University of Tokyo, Japan
Alberto Albiol, Universidad Politecnica Valencia, Spain
Naofal Al-Dhahir, AT&T Shannon Laboratory, United States
Yucel Altunbasak, Gatech, United States
Moeness Amin, Villanova University, United States
Ioannis Andreadis, Demokritos University of Thrace, Greece
Marc Antonini, CNRS, France
John Apostolopoulos, Hewlett-Packard Laboratories, United States
Amir Assadi, University of Wisconsin, United States
Jaakko T. Astola, Tampere University of Technology, Finland
Les Atlas, University of Washington, United States
Xavier Aubert, Philips Research Laboratories, Germany
Laurent Balmelli, IBM Research, United States
Richard Baraniuk, Rice University, United States
Sergio Barbarossa, University of Rome ''La Sapienza'', Italy
Michel Barlaud, University Of Nice, France
Kenneth Barner, University of Delaware, United States
Mauro Barni, University of Siena, Italy
Victor A. N. Barroso, ISR - IST, Portugal
Alain Barthelemy, Technology Service Corporation, United States
Franco Bartolini, Università di Firenze, Italy
Kristine Bell, George Mason University, United States
Jerome Bellegarda, Apple Computer, Inc., United States
Erwin Bellers, Philips Semiconductors, United States
Jacob Benesty, Bell Labs, Lucent Technologies, United States
Fabrizo Berizzi, University of Pisa, Italy
Jose Carlos Bermudez, Federal University of Santa Catarina, Brazil
Olivier Besson, ENSICA, France
Shuvra Bhattacharyya, University of Maryland, United States
Jeff Bier, BDTI, United States
Jeff Bilmes, University of Washington, Seattle, United States
Bruce A. Black, Rose-Hulman Institute of Technology, United States
Johann Boehme, Ruhr Universität Bochum, Germany
Helmut Boelcskei, ETH Zurich, Switzerland
Federica Bordoni, University of Pisa, Italy
Adrian Bors, University of York, United Kingdom
Marina Bosi, Stanford University, United States
Charles A. Bouman, Purdue University, United States
Herve Bourlard, IDIAP, Switzerland
V. Michael Bove Jr., MIT Media Laboratory, United States
Karlheinz Brandenburg, Fraunhofer AEMT, Germany
Michael Brandstein, Harvard University, United States
Charles Broun, Motorola, United States
Madhukar Budagavi, Texas Instruments, United States
Wayne Burleson, University of Massachusetts, Amherst, United States
Nick Campbell, ATR Spoken Language Translation Research Laboratories, Japan
Peter Cappello, University of California, Santa Barbara, United States
Jean-Francois Cardoso, CNRS/ENST, France
Francky Catthoor, IMEC, Belgium
A. Enis Cetin Bilkent University, Turkey
Mujdat Cetin MIT, United States
Chaitali Chakrabarti, Arizona State University, United States
W.-Y. Geoffrey Chan, Queen's University, Canada
Y. T. Chan, Chinese University of Hong Kong, Hong Kong SAR of China
Shih-Fu Chang, Columbia University, United States
Rama Chellappa, University of Maryland, United States
Liang-Gee Chen, National Taiwan University, Taiwan
Tsuhan Chen, Carnegie Mellon University, United States
Corey Cheng, Dolby Laboratories, Inc., United States
Chong-Yung Chi, National Tsing Hua University, Taiwan
Archana Chidanandan, University of Louisiana, Lafayette, United States
Seungjin Choi, POSTECH, Republic of Korea
Philip A. Chou, Microsoft Research, United States
Henry, Chu University of Louisiana, Lafayette, United States
Andrew Cichocki, BSI Riken, Japan
M. Reha Civanlar, Koç University, Turkey
Michael Clark, Mission Research Corp., United States
Doug Cochran, Arizona State University, United States
Jean Pierre Cocquerez, University of Technology of Compiegne, France
Martin Cohen, Raytheon IDS, United States
Mary Comer, Thomson, United States
Chuck Creusere, New Mexico State University, United States
Andreas Czylwik, Gerhard-Mercator University Duisburg, Germany
Tarek Darwish, University of Louisiana, Lafayette, United States
Grant Davidson, Dolby Laboratories, Inc., United States
Timothy Davidson, McMaster University, Canada
Antonio De Maio, University of Naples "Federico II", Italy
Renato de Mori, University of Avignon, France
Ricardo de Queiroz, Universidade de Brasilia, Brazil
Victor DeBrunner, University of Oklahoma, United States
Michael Deisher, Intel Corporation, United States
Li Deng, Microsoft Research, United States
Xavier Descombes, INRIA, France
Zhi Ding, University of California, Davis, United States
Petar M. Djuric, Stony Brook University, United States
Minh N. Do, University of Illinois, Urbana-Champaign, United States
Peter C. Doerschuk, Purdue University, United States
Arnaud Doucet, Cambridge University, United Kingdom
Scott Douglas, Southern Methodist University, United States
Eric Dubois, University of Ottawa, Canada
Jean-Luc Dugelay, Eurecom Institute, France
Adriana Dumitras, Apple Computer, Inc., United States
Geoffrey Edelson, BAE Systems, United States
Michelle Effros, California Institute of Technology, United States
John Eldon, Pulse~LINK, Inc., United States
Alexandros Eleftheriadis, Columbia University, United States
Mohamed Elgamel, University of Louisiana, Lafayette, United States
Walid Elgharbawy, University of Louisiana, Lafayette, United States
Gary Elko, Avaya Labs, United States
Steve Elliott, ISVR University of Siothampton, United Kingdom
Brian Evans, University of Texas, Austin, United States
Craig Fancourt, Sarnoff Corp., United States
Alfonso Farina, Alenia-Marconi Systems, Italy
Bruce Fette, General Dynamics, United States
Mario A. T. Figueiredo, Instituto Superior Técnico, Portugal
Paul Fiore, BAE Systems, United States
John Fisher, Massachusetts Institute of Technology, United States
Patrick Flandrin, CNRS - ENS Lyon, France
Javier Rodriguez Fonollosa, Technical University of Catalonia, Spain
James E. Fowler, Mississippi State University, United States
Jose Fridman, Analog Devices, Inc., United States
Pascal Frossard, IBM T.J. Watson Research Center, United States
Jean-Jacques Fuchs, IRISA, France
Daniel R. Fuhrmann, Washington University, United States
Sadaoki Furui, Tokyo Institute of Technology, Japan
Steven Gay, MIT Lincoln Laboratory, United States
Hongya Ge, New Jersey Institute of Technology, United States
Bryan George, The MITRE Corporation, United States
Nikos Georgis, Nokia, Inc., United States
Alex B. Gershman, McMaster University, Canada
Mohammad Gharavi-Alkhansari, McMaster University, Canada
Fulvio Gini, University of Pisa, Italy
John Glossner, Sandbridge Technologies, United States
Lal C. Godara, University of New South Wales, Australia
Simon Godsill, University of Cambridge, United Kingdom
Jose Gomes, IBM T.J. Watson Research Center, United States
Mike Goodwin, Creative ATC, United States
Ramesh Gopinath, IBM T.J. Watson Research Center, United States
Michael Gormish, Ricoh Innovaitions, Inc., United States
Alexei Gorokhov, Philips Research, Netherlands
John Goutsias, The Johns Hopkins University, United States
Vivek K. Goyal, Digital Fountain, United States
Raffaele Grasso, SACLANT Nato Center, Italy
Doug Gray, University of Adelaide, Australia
Robert M. Gray, Stanford University, United States
Maria S. Greco, University of Pisa, Italy
Ling Guan, Ryerson University, Canada
Christine Guillemot, INRIA, France
Fredrik Gustafsson, Linköping University, Sweden
Martin Haardt, Ilmenau University of Technology, Germany
Raouf Hamzaoui, University of Konstanz, Germany
Yoichi Haneda, NTT Corporation, Japan
Alan Hanjalic, Delft University of Technology, Netherlands
Monson Hayes, Georgia Institute of Technology, United States
Larry Heck, Nuance Communications, United States
Ryan Heidari, Nokia, Inc., United States
Janne Heikkilä, University of Oulu, Finland
Wendi B. Heinzelman, University of Rochester, United States
Sheila S. Hemami, Cornell University, United States
Alfred O. Hero, University of Michigan, United States
Juergen Herre, Fraunhofer IIS-A, Germany
K. C. Ho, University of Missouri, Columbia, United States
Yo-Sung Ho, K-JIST, Republic of Korea
Osamu Hoshuyama, NEC Corporation, Japan
Yu Hen Hu, University of Wisconsin, United States
Yingbo Hua, University of California, Riverside, United States
Jeng-Neng Hwang, University of Washington, United States
Mohammad Ibrahim, King Fahd University of Petroleum and Minerals, Saudi Arabia
Mary Jane Irwin, Penn State University, United States
Daniel Jacoby, Queensland University of Technology, Argentina
Andreas Jakobsson, King's College London, United Kingdom
Magnus Jansson, KTH, Sweden
Ian Jermyn, INRIA, France
Ed Jernigan, University of Waterloo, Canada
Sergio Jesus, University of Algarve, Portugal
Don H. Johnson, Rice University, United States
James D. Johnston, Microsoft Corporation, United States
Tecpanecatlxihuitl Jose, University of Louisiana, Lafayette, United States
Mark Kahrs, University of Pittsburgh, United States
Ton Kalker, Philips Research, Netherlands
Samuel Kaski, Helsinki University of Technology, Finland
Jim Kates, Cirrus Logic, United States
Aggelos Katsaggelos, Northwestern University, United States
Walter Kellermann, University Erlangen, Germany
R. Lynn Kirlin, University of Victoria, Canada
Thia Kirubarajan, McMaster University, Canada
W. Bastiaan Kleijn, KTH, Sweden
Stephen Kogon, MIT Lincoln Laboratory, United States
Anil Kokaram, Trinity College Dublin, Ireland
Ravi Kolagotla, Intel Corporation, United States
Lisimachos Kondi, SUNY at Buffalo, United States
Janusz Konrad, Boston University, United States
Konstantinos Konstantinides, Cirrus Logic, United States
Alex C. Kot, Nanyang Technological University, Singapore
Hamid Krim, North Carolina State University, United States
Jeffrey Krolik, Duke University, United States
Robert F. Kubichek, University of Wyoming, United States
Roland Kuhn, Panasonic Technologies Company, Matsushita Electric Corporation of America, United States
Deepa Kundur, Texas A&M University, United States
Murat Kunt, Signal Processing Institute, Switzerland
C.-C Jay Kuo, University of Southern California, United States
Chung-Chieh (Jay) Kuo, University of Southern California, United States
Ichiro Kuroda, NEC Corporation, Japan
Ercan Kuruoglu, Consiglio Nazionale delle Recerche (CNR), Italy
Chris Kyriakakis, University of Southern California, United States
Reginald Lagendijk, Delft University of Technology, Netherlands
Patrick Lambert, Université de Savoie LISTIC, France
Jean Laroche, Creative ATC, United States
Jan Larsen, Technical University of Denmark, Denmark
Erik Larsson, University of Florida, United States
Longin Jan Latecki, Temple University, United States
Jose Lay, University of Sydney, Australia
Chin-Hui Lee, Georgia Institute of Technology, United States
Ivan Lee, University of Sydney, Australia
Krisda Lengwehasatit, PacketVideo Corp., United States
Matthew Lennig, Nuance Communications, United States
Geert Leus, K.U.Leuven, Belgium
Hongbin Li, Stevens Institute of Technology, United States
Jian Li, University of Florida, United States
Jin Li, Microsoft Research, United States
Qi (Peter) Li, Li Creative Technologies, United States
Yijun Li, University of Louisiana, Lafayette, United States
Laurence Likforman, ENST/LTCI, France
K. J. Ray Liu, University of Maryland, United States
Philip Loizou, University of Texas, Dallas, United States
Fabrizo Lombardini, University of Pisa, Italy
Philippe Loubaton, Marne la Vallée University, France
Isabel Lourtie, Instituto Superior Técnico, Portugal
Ligang Lu, IBM T.J. Watson Research Center, United States
Marco Luise, University of Pisa, Italy
Jiebo Luo, Eastman Kodak Company, United States
Zhi-Quan Luo, McMaster University, Canada
Robert Lynch, Naval Undersea Warfare Center, United States
Kai-Kuang Ma, Nanyang Technological University, Singapore
Ning Ma, DSO National Laboratories, Singapore
Benoit Macq, Catholic University of Louvain, Belgium
Henri Maitre, Telecom-Paris ENST, France
Shoji Makino, NTT Communication Science Laboratories, Japan
Stephane Mallat, Ecole Polytechnique, France
Henrique Malvar, Microsoft Research, United States
Danilo Mandic, Imperial College, United Kingdom
B.S. Manjunath, University of California, Santa Barbara, United States
Kazunori Mano, NTT Corporation, Japan
Elias Manolakos, Northeastern University, United States
Jonathan Manton, University of Melbourne, Australia
Rainer Martin, Technical University of Braunschweig, Germany
Thomas Marzetta, Bell Labs, United States
Jiri Matas, Czech Technical University, Czech Republic
John McCanny, Queen's University, United Kingdom
Jim McClellan, Georgia Institute of Technology, United States
Christoph Mecklenbräuker, Forschungszentrum Telekommunikation Wien, Austria
Jose Manuel Menendez, Universidad Politecnica de Madrid, Spain
Helen Meng, Chinese University of Hong Kong, China
Hagit Messer-Yaron, Tel Aviv University, Israel
David J. Miller, Penn State University, United States
Sanjit K. Mitra, University of California, Santa Barbara, United States
Aleksandra Mojsilovic, IBM Research, United States
Christophe Molina, SANOFI-SYNTHELABO, France
Rafael Molina, University of Granada, Spain
Nelson Morgan, University of California, Berkeley, United States
Michael Morrow, University of Wisconsin, Madison, United States
Randy Moses, Ohio State University, United States
Pierre Moulin, University of Illinois, Urbana-Champaign, United States
Satoshi Nakamura, ATR Spoken Language Translation Research Laboratories, Japan
Shrikanth Narayanan, University of Southern California, United States
Arye Nehorai, University of Illinois, Chicago, United States
Chalapathy Neti, IBM T.J. Watson Research Center, United States
David Neuhoff, University of Michigan, United States
Hermann Ney, RWTH-Aachen, Germany
Truong Nguyen, University of California, San Diego, United States
Ulrich Nickel, FGAN-FHR, Germany
Robert Nowak, Rice University, United States
Naohisa Ohta, Sony, Japan
Don Orofino, The MathWorks, United States
Antonio Ortega, University of Southern California, United States
Joern Ostermann, AT&T Labs-Research, United States
Bjorn Ottersten, KTH, Sweden
Robert E. Owen, DATA/TIME International, United States
Mukund Padmanabhan, Renaissance Technologies, United States
Michele Pagano, University of Pisa, Italy
Kuldip Paliwal, Griffith University, Australia
Antonia Papandreou-Suppappola, Arizona State University, United States
Thrasyvoulos N. Pappas, Northwestern University, United States
Keshab Parhi, University of Minnesota, United States
Sarangarajan Parthasarathy, AT&T Labs-Research, United States
Fernando Pereira, Instituto Superior Técnico, Portugal
Marius Pesavento, Ruhr-University Bochum, Germany
Jean-Christophe Pesquet, Marne la Vallée University, France
Athina Petropulu, Drexel University, United States
Maria Petrou, University of Surrey, United Kingdom
Ioannis Pitas, Aristotle University of Thessaloniki, Greece
Konstantinos Plataniotis, University of Toronto, Canada
Christine Podilchuk, Bell Labs, United States
Kris Popat, Palo Alto Research Center (PARC), United States
Viktor Prasanna, University of Southern California, United States
Jose Principe, Univerisity of Florida, United States
Schulyer Quackenbush, Audio Research Labs, United States
Tom Quatieri, MIT Lincoln Laboratory, United States
Majid Rabbani, Eastman Kodak Company, United States
Rudolf Rabenstein, University of Erlangen-Nuremberg, Germany
Dan Rabideau, MIT Lincoln Laboratory, United States
Mazin Rahim, AT&T Labs-Research, United States
Kannan Ramchandran, University of California, Berkeley, United States
Muralidhar Rangaswamy, Air Force Research Laboratory, United States
Bhaskar D. Rao, University of California, San Diego, United States
Ram Rao, Intel Corporation, United States
Stanley Reeves, Auburn University, United States
Phillip Regalia, Institut National des Telecommunications, France
Carlo Regazzoni, University of Genova, Italy
Ruggero Reggiannini, University of Pisa, Italy
James Reilly, McMaster University, Canada
Steve Renals, University of Sheffield, United Kingdom
Maria Joao Rendas, CNRS-I3S, France
Bart Rice, Lockheed Martin, United States
Chirst Richmond, MIT Lincoln Laboratory, United States
Eve Riskin, University of Washington, United States
Kenneth Rose, University of California, Santa Barbara, United States
Jean Rouat, Université de Sherbrooke & Université du Québec à Chicoutimi, Canada
Michel Roux, ENST, France
Eli Saber, Xerox Corporation, United States
Brian M. Sadler, Army Research Laboratory, United States
Robert J. Safranek, Benevue, Inc., United States
Roxana Saint-Nom, Instituto Tecnologico de Buenos Aires, Argentina
Paul Salama, Indiana University, United States
Redwan Salami, VoiceAge Corporation, Canada
Philippe Salembier, Universitat Politècnica de Catalunya, Spain
Chong Meng Samson See, DSO National Laboratories, Singapore
Mark Sandler, Queen Mary University of London, United Kingdom
Stephen J Sangwine, University of Essex, United Kingdom
Ali H. Sayed, University of California, Los Angeles, United States
Louis Scharf, Colorado State University, United States
Gerald Schuller, Fraunhofer Institute, Germany
Guido Schuster, Hochschule Rapperswil, Switzerland
Ivan Selesnick, Polytechnic University, United States
M. Ibrahim Sezan, Sharp Labs of America, United States
Shahram Shahbazpanahi, McMaster University, Canada
Shihab Shamma, University of Maryland, United States
Yair Shoham, Lucent Technologies, United States
Giovanni L. Sicuranza, University of Trieste, Italy
Nicholas Sidiropoulos, University of Minnesota & Technical University of Crete, United States
Harvey Silverman, Brown University, United States
Malcolm Slaney, IBM Almaden Research Center, United States
Dirk Slock, Eurecom Institute, France
Mark J.T. Smith, Purdue University, United States
Bogdan Smolka, Silesian University of Technology, Poland
Hing Cheung So, City University of Hong Kong, Hong Kong SAR of China
Andreas Spanias, Arizona State University, United States
S. Sriram, Texas Instruments, United States
LJubisa Stankovic, University of Montenegro, Yugoslavia
Andreas Stolcke, SRI International, United States
Peter Sturm, INRIA, France
Akihiko Sugiyama, NEC Corporation, Japan
Wonyong Sung, Seoul National University, Republic of Korea
Johan Suykens, KU Leuven, ESAT-SCD-SISTA, Belgium
Ananthram Swami, Army Research Laboratory, United States
John Tague, Office of Naval Research, United States
Jonathan Thorn, Texas Instruments, United States
Ed Titlebaum, University of Rochester, United States
Steve Tjiang, Catalytic Compilers, Inc, United States
Keiichi Tokuda, Nagoya Institute of Technology, Japan
Lang Tong, Cornell University, United States
Luis Torres, Technical University of Catalonia, Spain
Jean-Yves Tourneret, ENSEEIHT/IRIT, France
Isabel Trancoso, IST / INESC-ID Lisboa, Portugal
Jennifer Trelewicz, IBM Almaden Research, United States
Timothy Trenary, IBM, United States
Michail K. Tsatsanis, Voyan Technology, United States
Jitendra Tugnait, Auburn University, United States
Aurelio Uncini, University of Rome ''La Sapienza'', Italy
Michael Unser, Swiss Federal Institute of Technology (EPFL), Switzerland
Rick Vaccaro, University of Rhode Island, United States
P. P. Vaidyanathan, California Institute of Technology, United States
Dirk Van Compernolle, K.U.Leuven, Belgium
Alle-Jan van der Veen, Delft University of Technology, Netherlands
Marc M. Van Hulle, K.U.Leuven, Belgium
Jan van Santen, Ohio Health & Science University, United States
Barry D. Van Veen, University of Wisconsin, United States
Luc Vandendorpe, Catholic University of Louvain, Belgium
Pramod K. Varshney, Syracuse University, United States
Peter Vary, Aachen University, Germany
Nuno Vasconcelos, Hewlett-Packard, United States
Ingrid Verbauwhede, University of California, Los Angeles, United States
Gianni Vernazza, University of Genova, Italy
Olivier Verscheure, IBM T.J. Watson Research Center, United States
Mats Viberg, Chalmers University of Technology, Sweden
Vishu Viswanathan, Texas Instruments, United States
Sergiy Vorobyov, McMaster University, Canada
DeLiang Wang, Ohio State University, United States
Darren Ward, Imperial College London, United Kingdom
Susie Wee, Hewlett-Packard Labs, United States
Thad Welch, U.S. Naval Academy, United States
Christian Wellekens, Eurecom Institute, France
Peter H. Westerink, IBM, United States
Maria S. Greco, University of Pisa, Italy
Peter Willett, University of Connecticut, United States
Douglas Williams, Georgia Institute of Technology, United States
Beth Wilson, University of Louisiana, Lafayette, United States
Richard Wilson, University of York, United Kingdom
Brendt Wohlberg, Los Alamos National Lab, United States
Kainam Thomas Wong, University of Waterloo, Canada
Kon Max Wong, McMaster University, Canada
Roger Woods, Queen's University Belfast, United Kingdom
Cameron Wright, U.S. Air Force Academy, United States
Min Wu, University of Maryland, College Park, United States
Rolf Wuertz, Ruhr-University, Germany
Xiang-Gen Xia, University of Delaware, United States
Andrew E. Yagle, University of Michigan, United States
Takao Yamazaki, Sony Electronics, United States
Kung Yao, University of California, Los Angeles, United States
Michael Zatman, MIT Lincoln Laboratory, United States
Yehoshua Y. Zeevi, Columbia University and Technion, United States
Josiane Zerubia, INRIA, France
Michalis Zervakis, Technical University of Crete, Greece
Yimin Zhang, Villanova University, United States
Feng Zhao, Palo Alto Research Center (PARC), United States
Peiyi Zhao, University of Louisiana, Lafayette, United States
Haitao Zheng, Lucent Technologies, United States
G. Tong Zhou, Georgia Institute of Technology, United States
Xiong Zixiang, Texas A&M University, United States
Michael Zoltowski, Purdue University, United States
Abdelhak M. Zoubir, Curtin University of Technology, Australia